Details about Research Scholarship in Engineering Processable - Tough Hydrogels 2023
Research Scholarship in Engineering Processable - Tough Hydrogels 2023 is offered for PhD degree in the field of Engineering. You can apply to this scholarship here. The deadline for the sending your application is Deadline varies. This scholarship is provided by The University of Sydney and the value of this scholarship is Partial Funding, course fees + stipend . This scholarship is open for: Open to all nationals.
- Degree: PhD
- Provided by: The University of Sydney
- Deadline: Deadline varies
- Scholarship value: Partial Funding, course fees + stipend
Background:
This scholarship has been established by the Bioengineering Laboratory in the School of Chemical and Biomolecular Engineering at the University of Sydney to support a PhD student who is undertaking research in designing a tough and versatile hydrogel with self-healing properties. This project will aim to design a type of hydrogel with broad applications in soft robotic, medical devices such as heart valves, vasculature, and the development of in vitro model that mimics the physical properties of the digestion system including the colon, intestine and stomach.
Eligibility for the Research Scholarship in Engineering Processable - Tough Hydrogels:
- Applicants must have an unconditional offer of admission to study full-time for a PhD within the Faculty of Engineering at the University of Sydney.
- Applicants must be willing to conduct research in designing a tough and versatile hydrogel with self-healing properties.
- Candidates should hold an Honours degree (First Class or Second Class Upper) or equivalent in polymer engineering and chemistry or a relevant discipline.
- Students must apply for the Research Training Program (RTP) Stipend Scholarships.
Benefits:
- An annual stipend allowance equivalent to the University of Sydney's Research Training Program (RTP) stipend rate, for up to three years, subject to satisfactory academic performance.
- Academic course fees.