Details about Bond University International Student Scholarship, 2022
Bond University International Student Scholarship, 2022 is offered for Bachelors, Masters degree in the field of All subjects offered by the University. You can apply to this scholarship here. The deadline for the sending your application is Deadline varies. This scholarship is provided by Bond University and the value of this scholarship is Partial Funding, up to 25% tuition remission . This scholarship is open for: Open to selected countries.
- Degree: Bachelors, Masters
- Provided by: Bond University
- Deadline: Deadline varies
- Scholarship value: Partial Funding, up to 25% tuition remission
Bond will select the successful applicants through a competitive, merit-based process.
This will include a review of each applicant’s academic achievement as demonstrated by their academic results from their home country qualification and supporting statement.
Incomplete applications will not be considered.
Successful applicants will be notified of the outcome prior to their semester start date.
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