Details about Vynka Hohnen Scholarship at Bond University 2024
Vynka Hohnen Scholarship at Bond University 2024 is offered for Bachelors degree in the field of subjects offered by the university excluding the Medical Program and Diploma . You can apply to this scholarship here. The deadline for the sending your application is 01 Aug, 2024. This scholarship is provided by Bond University and the value of this scholarship is Only tuition fees, full fees waiver . This scholarship is open for: Open to Australian nationals.
- Degree: Bachelors
- Provided by: Bond University
- Deadline: 01 Aug, 2024
- Scholarship value: Only tuition fees, full fees waiver
The Vynka Hohnen Scholarship, offered by Bond University, is a prestigious award to acknowledge young achievers from Western Australia who demonstrate leadership, community involvement, academic excellence, and a generous nature. This scholarship provides full tuition remission for any undergraduate degree (excluding the Bond Medical Program and Diploma entry students) to one outstanding Year 12 student annually.
Eligibility Criteria:
- Applicant must be a domestic student completing Year 12 at a Western Australian secondary school.
- She is predicted to achieve a minimum of ATAR 95.00 or IB Diploma 38.
- Demonstrated record of leadership, initiative, and service to school and/or community.
- Prepared to maintain a high level of academic and personal excellence at Bond University.
Value of the Scholarship :
- 100% tuition remission for any single undergraduate degree (excluding the Bond Medical Program and Diploma entry students).
- Opportunity to commence studies in the January semester following completion of Year 12.
- Mandatory selection weekend at Bond University (travel and accommodation expenses covered by the University) for short-listed applicants.
Application Process:
- Complete the Bond University Study Application Form for the chosen program.
- Complete the Bond University Scholarship Application Form, using the same log-in details, and enter 'scholarship' in the keyword field.
- Submit all required documents before the application closing date. No late applications will be considered.
Deadline: August 1, 2024.
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