Details about Bond University - Excellence Scholarships for China, Hong Kong and Taiwan, 2019
Bond University - Excellence Scholarships for China, Hong Kong and Taiwan, 2019 is offered for Bachelors, Masters degree in the field of Courses offered by the University. You can apply to this scholarship here. The deadline for the sending your application is 05 Jul 2019. This scholarship is provided by Bond University and the value of this scholarship is Partial Funding, 25% of tuition fee . This scholarship is open for: China, Taiwan, Hong Kong.
- Degree: Bachelors, Masters
- Provided by: Bond University
- Deadline: 05 Jul 2019
- Scholarship value: Partial Funding, 25% of tuition fee
Bond University is offering Excellence Scholarship to incoming undergraduate and graduate students from China, Taiwan, and Hong Kong. The Excellence Scholarships is a merit-based Scholarship and judged based on academic excellence.
Eligibility for Bond University - Excellence Scholarships in New Zealand, 2019:
- The applicant must be a citizen of China, Taiwan, and Taiwan and must be currently residing in these countries.
- The applicant must have an offer of admission from Bond University.
- The applicant's offer of admission must be in an Undergraduate or postgraduate program with few exceptions.
- The applicant must maintain an average of 65% or higher to be eligible for renewal.
- The applicant must engage in promotional activities organized by the University.
Value of Bond University - Excellence Scholarships in New Zealand, 2019:
- The successful applicants of Bond University - Excellence Scholarships in New Zealand, 2019 will receive a 25% tuition fee remission each semester.
- The recipient can renew their Scholarships if can satisfy their University's criteria.
Deadline for Bond University's Excellence Scholarship in New Zealand, 2019:
- The last date to apply for Bond University's Excellence Scholarship for students attending University from September 2019 semester is 5th July 2019.